Journal Profile | |||||||||||||||||||||||||
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Journal Title | IEEE Transactions on Components Packaging and Manufacturing Technology | ||||||||||||||||||||||||
Journal Title Abbreviations | IEEE T COMP PACK MAN | ||||||||||||||||||||||||
ISSN | 2156-3950 | ||||||||||||||||||||||||
h-index | 39 | ||||||||||||||||||||||||
CiteScore |
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Self-Citation Ratio (2019-2020) | 16.60% | ||||||||||||||||||||||||
Official Website | https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT | ||||||||||||||||||||||||
Online Manuscript Submission | |||||||||||||||||||||||||
Open Access | No | ||||||||||||||||||||||||
Publisher | |||||||||||||||||||||||||
Subject Area | ENGINEERING, MANUFACTURING | ||||||||||||||||||||||||
Country/Area of Publication | UNITED STATES | ||||||||||||||||||||||||
Publication Frequency | |||||||||||||||||||||||||
Year Publication Started | 2011 | ||||||||||||||||||||||||
Annual Article Volume | 269 | ||||||||||||||||||||||||
Indexing (SCI or SCIE) | Science Citation Index Science Citation Index Expanded | ||||||||||||||||||||||||
Link to PubMed Central (PMC) | https://www.ncbi.nlm.nih.gov/nlmcatalog?term=2156-3950%5BISSN%5D | ||||||||||||||||||||||||
Average Duration of Peer Review * | Authorized Data from Publisher: Data from Authors: Ordinary, 3-6 Week(s) | ||||||||||||||||||||||||
Competitiveness * | Data from Authors: Easy | ||||||||||||||||||||||||
Useful Links |
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*All review process metrics, such as acceptance rate and review speed, are limited to our user-submitted manuscripts. As such they may not reflect the journals' exact competitiveness or speed. |
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Reviews on IEEE Transactions on Components Packaging and Manufacturing Technology: | Write a review |
Author: 404414879@qq.com Subject Area: Engineering and Materials Duration of Peer Review: 12.0 month(s) Result: Accepted after revision Write a review |
Reviewed 2017-03-27 16:09:39 A journal in microelectronics engineering. Q4 in the Chinese Academy of Sciences ranking. Microelectronics material analysis experiments are usually expensive, but the impact factor of this journal is low and citation of papers published here will not be high, so the “performance-price ratio” of the journal is not high. Particularly suitable for high-end technical people working in industry to submit their papers. ![]() ![]() |
Author: 小学生 Subject Area: Engineering and Materials Duration of Peer Review: 4.0 month(s) Result: Pending & Unknown Write a review |
Reviewed 2018-03-12 13:05:16 has been submitted for 4 months, has been Under Review, which big god knows that he can only finish the trial, heart tired.Scholarships, what to think about, the heart is stuffed ah ![]() ![]() |
Author: 小学生 Subject Area: Engineering and Materials Duration of Peer Review: 4.0 month(s) Result: Pending & Unknown Write a review |
Reviewed 2018-03-12 13:05:10 has been selectd for 4 months, has been Under Review, which big god knows when he can finish it, oh tired.Scholarships, what to think about, the heart is stuffed ah ![]() ![]() |
Author: 科研狗 Subject Area: Information Science Duration of Peer Review: 3.0 month(s) Result: Accepted after revision Write a review |
Reviewed 2018-02-26 14:28:55 The IEEE's good Trans journal focuses on component design and packaging manufacturing technology, but the influence factor has not been able to go up, and the number of submissions has become less and less, resulting in fewer articles per issue.I hope that the CPMT Association can take some measures to improve the impact factor of the journal. ![]() ![]() |
Author: Anonymous Subject Area: Information Science Duration of Peer Review: 2.0 month(s) Result: Pending & Unknown Write a review |
Reviewed 2017-11-14 16:40:05 Very good trans journal, that is, the impact factor has not been able to go up, only to fall into the four districts.The vicious circle causes the quality of the received manuscript to be worse... ![]() ![]() |
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