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IEEE Transactions on Components Packaging and Manufacturing Technology

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Journal Profile
Journal TitleIEEE Transactions on Components Packaging and Manufacturing Technology
Journal Title AbbreviationsIEEE T COMP PACK MAN
ISSN2156-3950
h-index39
CiteScore
CiteScoreSJRSNIPCiteScore Rank
3.800.6321.300
Subject fieldQuartilesRankPercentile
Category: Engineering
Subcategory: Industrial and Manufacturing Engineering
Q175 / 340
Category: Engineering
Subcategory: Electronic, Optical and Magnetic Materials
Q274 / 234
Category: Engineering
Subcategory: Electrical and Electronic Engineering
Q2202 / 670

Self-Citation Ratio (2019-2020)16.60%
Official Websitehttps://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT
Online Manuscript Submission
Open AccessNo
Publisher
Subject AreaENGINEERING, MANUFACTURING
Country/Area of PublicationUNITED STATES
Publication Frequency
Year Publication Started2011
Annual Article Volume269
Indexing (SCI or SCIE)Science Citation Index
Science Citation Index Expanded
Link to PubMed Central (PMC)https://www.ncbi.nlm.nih.gov/nlmcatalog?term=2156-3950%5BISSN%5D
Average Duration of Peer Review *Authorized Data from Publisher:
Data from Authors: Ordinary, 3-6 Week(s)
Competitiveness *Data from Authors: Easy
Useful Links
Relevant Journals 【IEEE Transactions on Components Packaging and Manufacturing Technology】CiteScore Trend
Comments from Authors
*All review process metrics, such as acceptance rate and review speed, are limited to our user-submitted manuscripts. As such they may not reflect the journals' exact competitiveness or speed.
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  Reviews on IEEE Transactions on Components Packaging and Manufacturing Technology: Write a review
Author: 404414879@qq.com


Subject Area: Engineering and Materials
Duration of Peer Review: 12.0 month(s)
Result: Accepted after revision


Write a review

Reviewed 2017-03-27 16:09:39
A journal in microelectronics engineering. Q4 in the Chinese Academy of Sciences ranking.  Microelectronics material analysis experiments are usually expensive, but the impact factor of this journal is low and citation of papers published here will not be high, so the “performance-price ratio” of the journal is not high. Particularly suitable for high-end technical people working in industry to submit their papers.

(5) Thank | 404414879@qq.com

Author: 小学生


Subject Area: Engineering and Materials
Duration of Peer Review: 4.0 month(s)
Result: Pending & Unknown


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Reviewed 2018-03-12 13:05:16
has been submitted for 4 months, has been Under Review, which big god knows that he can only finish the trial, heart tired.Scholarships, what to think about, the heart is stuffed ah
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(0) Thank | 小学生

Author: 小学生


Subject Area: Engineering and Materials
Duration of Peer Review: 4.0 month(s)
Result: Pending & Unknown


Write a review

Reviewed 2018-03-12 13:05:10
has been selectd for 4 months, has been Under Review, which big god knows when he can finish it, oh tired.Scholarships, what to think about, the heart is stuffed ah
Show Review in Original Language
(0) Thank | 小学生

Author: 科研狗


Subject Area: Information Science
Duration of Peer Review: 3.0 month(s)
Result: Accepted after revision


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Reviewed 2018-02-26 14:28:55
The IEEE's good Trans journal focuses on component design and packaging manufacturing technology, but the influence factor has not been able to go up, and the number of submissions has become less and less, resulting in fewer articles per issue.I hope that the CPMT Association can take some measures to improve the impact factor of the journal.
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(0) Thank | 科研狗

Author: Anonymous


Subject Area: Information Science
Duration of Peer Review: 2.0 month(s)
Result: Pending & Unknown


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Reviewed 2017-11-14 16:40:05
Very good trans journal, that is, the impact factor has not been able to go up, only to fall into the four districts.The vicious circle causes the quality of the received manuscript to be worse...
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(1) Thank | Anonymous

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